Master-slice type semiconductor integrated circuit device having

Details Master-slice type semiconductor integrated circuit device having Master-slice type semiconductor integrated circuit device having

1993-06-25

1995-07-18

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular chip input/output means

257206, 257207, H01L 2702

Patent

active

054344360

ABSTRACT:
A plurality of different power source potentials are optionally selected in a semiconductor integrated circuit. First and second semiconductor segments (3) and (4) are both in the form of a number of rows which are separated from each other by spacings (14). Power source wires (6) and (7) for supplying potentials (V1) and (V2) are disposed above the second semiconductor regions (4). Cells are formed in different wells, and therefore, it is possible that different cells receive different power source potentials. Contacts (61) or (71) are made to the second semiconductor segments (4) so that the second semiconductor segments (4) are connected to the power source wire (6) or (7). Selection of and connection to one of the wires are attained in a slicing process.

REFERENCES:
patent: 4992845 (1991-02-01), Arakawa et al.
patent: 5007025 (1991-04-01), Hwang et al.
patent: 5083181 (1992-01-01), Yoshida et al.
patent: 5119169 (1992-05-01), Kozono et al.

Affiliated with

Also associated with

Rating

Master-slice type semiconductor integrated circuit device having does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Master-slice type semiconductor integrated circuit device having, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Master-slice type semiconductor integrated circuit device having will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2419891