Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-07-07
1995-07-18
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174257, 174258, H05K 109
Patent
active
054343631
ABSTRACT:
A metallic wiring board includes nitrogen implanted in a surface of a substrate or a protective layer including nitrogen formed on the substrate upon which is formed a metallic film including, as a main component, one of Ta and Nb. An insulating film covering the metallic wiring is formed by anodic oxidation. The nitrogen in the substrate or the protective layer prevents Ta (or Nb) ions from entering the substrate during the anodic oxidation of the metallic wiring. As a result, insulating properties of the substrate are not degraded during the oxidation.
REFERENCES:
patent: 5266815 (1993-11-01), Sunami et al.
patent: 5294560 (1994-03-01), Ono et al.
Patent Abstracts of Japan, vol. 313, No. 277 (E-778) 26 Jun. 1989 & JP-A-01 064 253 (Ricoh Co. Ltd.) 10 Mar. 1989.
Patent Abstracts of Japan, vol. 7, No. 264 (E-212) 24 Nov. 1983 & JP-A-58 147 069 (Sharp KK).
Wyatt, IEEE Transactions on Components, Hybridgs, and Manufacturing Technology, vol. CHMT-1, No. 2, pp. 148-151, Jun. 1978.
Goto Masahito
Hibino Yoshitaka
Hirata Mitsuaki
Morimoto Hiroshi
Nagayasu Takayoshi
Picard Leo P.
Sharp Kabushiki Kaisha
Thomas L.
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