Printed circuit based for mounted semiconductors and other elect

Details Printed circuit based for mounted semiconductors and other elect Printed circuit based for mounted semiconductors and other elect

1992-04-30

1994-05-10

Paumen, Gary F.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361777, 257676, 257723, 174 524, H01L 2302

Patent

active

053114078

ABSTRACT:
An improved printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density. Thus, according to the present invention, it is possible to provide a simply constructed electronic component mounting PCB which facilitates the design of circuits, and affords excellent connection reliability, which can readily form a heat radiating structure, and in which the thermal matching with the electronic component is excellent.

REFERENCES:
patent: 4305204 (1981-12-01), Toggart et al.
patent: 4649461 (1987-03-01), Matsuta
patent: 4677528 (1987-06-01), Miniet
patent: 4725920 (1988-02-01), Ijichi et al.
patent: 4763188 (1988-08-01), Johnson
patent: 4908933 (1990-03-01), Sagisaka et al.

Affiliated with

Also associated with

Rating

Printed circuit based for mounted semiconductors and other elect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit based for mounted semiconductors and other elect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit based for mounted semiconductors and other elect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2416286