Semiconductor element

Details Semiconductor element Semiconductor element

1991-03-06

1993-11-16

Gonzalez, Frank

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257714, H01L 2302

Patent

active

052626733

ABSTRACT:
A semiconductor element is disclosed, with which it is possible to obtain an area sufficiently large for evacuating heat and to have a high thermal conductivity so as to have an extremely high heat evacuation efficiency by using cooling fins having a microchannel structure.

REFERENCES:
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4620215 (1986-10-01), Lee
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4860444 (1989-08-01), Herrell et al.
patent: 4881237 (1989-11-01), Donnelly
patent: 4894709 (1990-01-01), Phillips et al.
patent: 5057908 (1991-10-01), Weber
2244 Research Disclosure (1989) Nov., No. 307, New York, U.S. No. XP 000084638 30794 Enhanced Air-Cooled Heatsink, p. 856.
"High-Performance Heat Sinking for VLSI" by D. B. Tuckerman and R. F. W. Pease, IEEE Electron Device Letters, vol. EDL-2, No. 5, May, 1981.

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