Method and apparatus for manufacturing interconnects with fine l

Details Method and apparatus for manufacturing interconnects with fine l Method and apparatus for manufacturing interconnects with fine l

1991-04-22

1992-05-19

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 1714

Patent

active

051145588

ABSTRACT:
Metallic or non-metallic wires or bristles are attached to a hollow, cylindrical core. The wires or fibers are quite fine in diameter. Space is provided in the core in the shape of perforations for the transfer of electrolyte, which is fed from the hollow inner portion of the cylinder, along the fibers, to the copper substrate on an imaged substrate.
Electrical or non-electrical sources are employed. The wires may be electrically connected through the metal cylinder to the positive pole (anode) of the DC power source. The non-conductive fibers make direct contact with the metal to be etched. In the electrical device within the hollow cylinder but separated from the cylinder is positioned a perforated or mesh copper, which is connected electrically to the negative pole (cathode) of the DC power supply. A cell is now made between the copper laminate and the perforated copper inside the cylinder. Copper from the laminate (anode) is removed and deposited on the perforated copper (cathode).
The same apparatus is used for electroforming applications. The wires can be connected to the negative pole of the rectifier, while an anodically insoluble conductive substrate can be used in place of the counter-electrode within the hollow cylinder. By contacting an activated or metallic substrate with negatively charged fibers one can deposit metal in the exposed areas.

REFERENCES:
patent: 4159934 (1979-07-01), Kadija
patent: 4417962 (1983-11-01), Inoue

Affiliated with

Also associated with

Rating

Method and apparatus for manufacturing interconnects with fine l does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for manufacturing interconnects with fine l, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacturing interconnects with fine l will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2415763