Method of solder bonding processor package

Details Method of solder bonding processor package Method of solder bonding processor package

1993-07-27

1995-07-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

22818021, H05K 336

Patent

active

054329981

ABSTRACT:
Disclosed is a method of laminating circuitized polymeric dielectric panels with pad to pad electrical connection between the panels. This pad to pad electrical connection is provided by a transient liquid phase formed bond of a joining metallurgy characterized by a non-eutectic stoichiometry composition of a eutectic forming system. The eutectic temperature of the system is below the first thermal transition of the polymeric dielectric, and the melting temperature of the joining metallurgy composition is above the first thermal transition temperature of the polymeric dielectric.

REFERENCES:
patent: 4466184 (1984-08-01), Cuneo
patent: 4685210 (1987-08-01), King et al.
patent: 5146674 (1992-09-01), Frankeny et al.
patent: 5280414 (1994-01-01), Davis et al.
patent: 5309629 (1994-05-01), Traskos et al.
patent: 5316205 (1994-05-01), Melton

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