RF test equipment and wire bond interface circuit

Details RF test equipment and wire bond interface circuit RF test equipment and wire bond interface circuit

1991-12-02

1994-05-10

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158P, 371 226, G01R 3128

Patent

active

053111222

ABSTRACT:
An RF test equipment and wire bond interface circuit (150) for facilitating the on-wafer (100) testing of integrated circuits (120) has an electrical interface (102,104,106), for providing electrical coupling to the IC (120) and a low-pass filter structure connected between the electric interface (102,104,106) and the IC (120). The low-pass filter structure comprises a first inductive element (108) connected in series with the electrical interface (102,104,106) for simulating wire bond reactances, a second inductive element (114) connected in series with the first inductive element (108) for making contact with the IC (120) and at least one capacitor (110,112) connected between ground and a point common to both the first (108) and the second (114) inductive elements, for providing shunt capacitance and defining a Tee type low-pass matched filter at the input (121) and the output (123) of the IC (120). The RF test equipment and wire bond interface (150) assure the on-wafer performance of the IC (120) will correspond to its off-wafer performance, despite the addition of wire bonds (127,129 and 133,135).

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"Layout Rules for GHz-Probing", Cascade Microtech, Inc., P.O. Box 1589, Beaverton, Oregon 97075-1589, Copyright 1988 Cascade Microtech, Inc. (no month).

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