Registers – Records – Conductive
Patent
1988-02-03
1989-01-17
Pitts, Harold I.
Registers
Records
Conductive
235487, G06K 1906
Patent
active
047989467
ABSTRACT:
A plastic package for an IC card comprises a first package section and a section package section, both of which have a flat base and a rim which extends around the periphery of the base and projects therefrom. A groove is formed in the rim of the first package section, and a projection which fits into the groove is formed in the rim of the second package section. A bonding agent is applied to the inside of the groove, and the two package sections are combined with the top surfaces of the rims abutting and the projection inserted into the groove. In one form of the invention, the groove is preferably larger than the projection by an amount sufficient to prevent bonding agent from being forced out of the groove. In another form of the invention, grooves for storing bonding agent which overflows from the grooves are formed in the top surface of one of the rims on either side of the groove and projection.
REFERENCES:
patent: 4222516 (1980-09-01), Badet
Fujii Noriaki
Kitamura Mamoru
Yamada Akira
Mitsubishi Denki & Kabushiki Kaisha
Pitts Harold I.
LandOfFree
Plastic package for an IC card does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plastic package for an IC card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic package for an IC card will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2414266