Electronic equipment and lap-top type electronic equipment

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

165 803, 174 151, 257714, 361704, H05K 720

Patent

active

056468245

ABSTRACT:
A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.

REFERENCES:
patent: 4698728 (1987-10-01), Tustaniwskyj et al.
patent: 4791983 (1988-12-01), Nicol et al.
patent: 4807134 (1989-02-01), Tustaniwskyj et al.
patent: 5144531 (1992-09-01), Go et al.
patent: 5285347 (1994-02-01), Fox et al.
patent: 5323847 (1994-06-01), Koizumi et al.

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