Heat pipe exchanger system for cooling a hinged computing device

Details Heat pipe exchanger system for cooling a hinged computing device Heat pipe exchanger system for cooling a hinged computing device

1995-08-30

1997-07-08

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361700, 16510433, 174 152, G06F 120, H05K 720, F28D 1502

Patent

active

056468229

ABSTRACT:
A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edges. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second opening. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.

REFERENCES:
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5383340 (1995-01-01), Larson et al.

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