1986-03-21
1989-01-17
Sikes, William L.
357 81, 350320, G02B 626
Patent
active
047984392
ABSTRACT:
An improved technique for mounting optical components on a substrate comprises providing each component with a dedicated heating element on the component itself to permit controlled and well-localized heating of solder on the substrate during fixing. In the example illustrated the optical component is an optical fibre carrier comprising fibre (10), carrier plate (12) and heating element (20), which itself comprises an ink film resistor (22) deposited on a ceramic chip (21) having metallized electrical contacts (23).
REFERENCES:
patent: 3289046 (1966-11-01), Carr
patent: 4083054 (1978-04-01), Moraw et al.
patent: 4136357 (1979-01-01), Frederiksen
patent: 4237474 (1980-12-01), Ladany
patent: 4399541 (1983-08-01), Kovats et al.
patent: 4456334 (1984-06-01), Henry et al.
patent: 4460915 (1984-07-01), Engel
patent: 4523802 (1985-06-01), Sakaguchi et al.
patent: 4561006 (1985-12-01), Currie
patent: 4589732 (1986-05-01), Shiraishi et al.
patent: 4685766 (1987-08-01), Nishimura et al.
British Telecommunications plc
Gonzalez Frank
Sikes William L.
LandOfFree
Optical component mounting does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Optical component mounting, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Optical component mounting will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2411586