Expanded pad structure

Details Expanded pad structure Expanded pad structure

1978-07-03

1981-03-24

Wojciechowicz, Edward J.

357 68, H01L 2348

Patent

active

042583829

ABSTRACT:
A pad for connecting electrical chips in microelectronic circuits includes a bump built up on the connecting pad that had a dimension of the base that is less than that of the pad to prevent the bump from overlapping the edges of the pad and damaging or cracking the underlying structure of the chip during thermocompression bonding of leads to the bump.

REFERENCES:
patent: 4051508 (1977-09-01), Sato et al.
patent: 4146413 (1979-03-01), Yonezawa et al.

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