Polyglydicylphenyl ethers of alkyloxy chains for use in microele

Details Polyglydicylphenyl ethers of alkyloxy chains for use in microele Polyglydicylphenyl ethers of alkyloxy chains for use in microele

1996-05-31

1997-07-08

Wilson, D. R.

Organic compounds -- part of the class 532-570 series

Organic compounds

Heterocyclic carbon compounds containing a hetero ring...

428620, C07D40700

Patent

active

056463154

ABSTRACT:
This invention relates to flexible epoxy resins characterized by a low ionic contamination total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

REFERENCES:
patent: 5536855 (1996-07-01), Schultz et al.

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