Method for manufacturing a semiconductor device

Details Method for manufacturing a semiconductor device Method for manufacturing a semiconductor device

1996-07-12

1998-10-20

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 438460, 438464, B32B 3118, H01L 21301

Patent

active

058241779

ABSTRACT:
A semiconductor wafer, which can be divided into chips at a high yield and a low cost and easily handled during transfer thereof as well, is disclosed. In a semiconductor wafer of such structure that structures with a low mechanical strength, such as suspended microstructures, are exposed at a surface thereof, detachable adhesive sheet making up protective caps for the respective suspended microstructures are formed over the semiconductor wafer. By means of this, even if the semiconductor wafer is diced into the individual chips, respective microstructures on chips are protected from the external force, such as the pressure of cutting water, during the dicing process.

REFERENCES:
patent: 4921564 (1990-05-01), Moore
patent: 5313835 (1994-05-01), Dunn
patent: 5326726 (1994-07-01), Tsang et al.
patent: 5435876 (1995-07-01), Alfaro et al.
patent: 5447068 (1995-09-01), Tang
patent: 5597767 (1997-01-01), Mignardi et al.

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