Method of fabricating a focal plane array for hybrid thermal ima

Details Method of fabricating a focal plane array for hybrid thermal ima Method of fabricating a focal plane array for hybrid thermal ima

1995-01-03

1997-07-08

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29 2535, 29847, 216 62, 250332, 2503383, 2503384, 348165, 430313, 430314, 430329, H01L 2184, H01L 310264, B05D 512, G01J 522

Patent

active

056448384

ABSTRACT:
A hybrid thermal imaging system (20, 120) often includes a focal plane array (30, 130), a thermal isolation structure (50, 150) and an integrated circuit substrate (60, 160). The focal plane array (30, 130) includes thermal sensitive elements (42, 142) formed from a pyroelectric film layer (82), such as barium strontium titanate (BST). One side of the thermal sensitive elements (42, 142) may be coupled to a contact pad (62, 162) disposed on the integrated circuit substrate (60, 160) through a mesa strip conductor (56, 150) of the thermal isolation structure (50, 150). The other side of the thermal sensitive elements (42, 142) may be coupled to an electrode (36, 136). The various components of the focal plane array (30, 130) may be fabricated from multiple heterogenous layers (74, 34, 36, 82, 84) formed on a carrier substrate (70).

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