Composition of oxymethylene polymer and amide oligomers

Chemistry of carbon compounds – Miscellaneous organic carbon compounds – C-metal

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260 67FP, C08L 7702

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active

039609847

ABSTRACT:
A composition with high thermal stability possessing superior resistance to mold and die deposits comprises (A) an oxymethylene homopolymer or copolymer and (B) 0.01 to 10% by weight of an amide oligomer having a molecular weight of 800 to 10,000 and wherein the active ends (based upon either amine or acid terminal groups) of the oligomer constitute no more than 0.02 mole % of the formaldehyde segments in the oxymethylene polymer.

REFERENCES:
patent: 2174527 (1939-10-01), Peterson
patent: 2993025 (1961-07-01), Alsup
patent: 3355514 (1967-11-01), De Walle
patent: 3444265 (1969-05-01), O'Brien
patent: 3592873 (1971-07-01), Ishida
patent: 47-25243 (1972-10-01), JA Japan

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