Method of forming an integrated circuit assembly

Details Method of forming an integrated circuit assembly Method of forming an integrated circuit assembly

1974-12-20

1976-06-01

Hall, Carl E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29588, 29590, 29628, 174 52PE, 204 16, 357 72, H01L 2156

Patent

active

039598748

ABSTRACT:
A method of forming an integrated circuit assembly is disclosed. The method comprises selectively treating a surface of a carrier to delineate a pattern thereon capable of receiving a metal deposit. The pattern is contacted with a conductive lead of an integrated circuit. The pattern is also contacted with a conductive external element and a metal is then deposited on the pattern to form an assembly having a continuous conductive metal pattern joining the lead and the external element. The resultant metal-deposited assembly may then be encapsulated and removed from the carrier.

REFERENCES:
patent: 2874085 (1959-02-01), Brietzke
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3489952 (1970-01-01), Hinchey
patent: 3612955 (1971-10-01), Butherus et al.
patent: 3639215 (1972-02-01), Van Sciver et al.
patent: 3659035 (1972-04-01), Planzo
patent: 3783499 (1974-01-01), Hughes, Jr. et al.
patent: 3805375 (1974-04-01), La Combe et al.

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