Method of fabricating large area semiconductor arrays

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 51, 437226, 437228, 156643, 156647, 156646, H01L 2100, H01L 2102, H01L 2172, H01L 2198

Patent

active

048227552

ABSTRACT:
A method for separating chips formed on a silicon substrate is provided which uses a combination of reactive ion etching techniques combined with orientation etching to yield integrated chips having edges which can be more precisely butted together to form large area arrays.

REFERENCES:
patent: 3689389 (1972-09-01), Waggener
patent: 4295924 (1981-10-01), Garnache et al.
patent: 4358340 (1982-11-01), Fu
patent: 4409319 (1983-10-01), Colacino et al.
patent: 4523369 (1985-06-01), Nagakubo
patent: 4526631 (1985-07-01), Silvestri et al.
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 4589952 (1986-05-01), Behringer et al.
patent: 4604161 (1986-08-01), Araghi
patent: 4612554 (1986-09-01), Poleshuk
patent: 4661201 (1987-04-01), Petridis et al.
patent: 4670092 (1985-06-01), Motamedi
Jackson, T. N., An Electrochemical P-N Junction Etch-Stop for The Formation of Silicon Microstructures, 2/81, IEEE Electron Device Lett., vol. EDL-2, No. 2, pp. 44-45.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating large area semiconductor arrays does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating large area semiconductor arrays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating large area semiconductor arrays will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2396868

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.