Method for applying an adhesive layer to a substrate surface

Details Method for applying an adhesive layer to a substrate surface Method for applying an adhesive layer to a substrate surface

1996-08-29

1998-12-01

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156250, 1562739, 1562757, 204489, 427469, B32B 3112

Patent

active

058432590

ABSTRACT:
A method is described for uniformly coating portions of the surface of a substrate which is to be bonded to another substrate. In a described embodiment, the two substrates are channel plates and heater plates which, when bonded together, form a thermal ink jet printhead. The adhesive layer is electrophoretically deposited over a conductive pattern which has been formed on the binding substrate surface. The conductive pattern forms an electrode and is placed in an electrophoretic bath comprising a colloidal emulsion of a preselected polymer adhesive. The other electrode is a metal container in which the solution is placed or a conductive mesh placed within the container. The electrodes are connected across a voltage source and a field is applied. The substrate is placed in contact with the solution, and a small current flow is carefully controlled to create an extremely uniform thin deposition of charged adhesive micelles on the surface of the conductive pattern. The substrate is then removed and can be bonded to a second substrate and cured.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4391933 (1983-07-01), Scala et al.
patent: 4678529 (1987-07-01), Drake et al.
patent: 4844784 (1989-07-01), Suzuki et al.
patent: 5336319 (1994-08-01), Narang et al.

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