Method of manufacturing lead frame

Details Method of manufacturing lead frame Method of manufacturing lead frame

1996-10-16

1999-05-11

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

216 14, H01R43/00

Patent

active

059014369

ABSTRACT:
Leads are formed on a surface of an etching stop film of a base, and holes are defined in the base and a region of a substrate which corresponds to a lead-forming region is thinned by selective etching on both upper and lower surfaces of the base. A lead holder film having a device hole and an outer lead bonding slit is applied to the upper surface of the base. The thinned region of the substrate is removed by selective etching on the lower surface of the base, and the etching stop film is etched away.

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