Electroplating composition and process

Details Electroplating composition and process Electroplating composition and process

1990-01-29

1991-11-26

Niebling, John

Chemistry: electrical and wave energy

Processes and products

204 521, C25D 338, C25D 700

Patent

active

050680137

ABSTRACT:
A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

REFERENCES:
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3562117 (1971-02-01), Vander Mey
patent: 3769179 (1973-10-01), DuRose et al.
patent: 3770598 (1973-11-01), Creutz
Product Specification, "POLYOX" Water-Soluble Resin WSR-N750, Union Carbide, May 22, 1987.
Amadi, S. I.; "Platin High Aspect Ratio Multilayer Boards", PC FAB, Oct. 1987, pp. 85-94.

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