Method of fabricating a thin film inductive head having a second

Details Method of fabricating a thin film inductive head having a second Method of fabricating a thin film inductive head having a second

1996-10-17

1999-05-11

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

2960315, 2960316, 216 22, 360126, G11B5/127

Patent

active

059014318

ABSTRACT:
A method is disclosed for fabricating a high density recording head having a narrow, well-defined second pole tip for recording data with an areal density in the range of 5 gigabits. The second pole tip is connected to a mushroom yoke which extends across underlying insulated coils. The second pole tip and yoke are formed at the same time using conventional photolithographic and plating processes. By using a preselected thickness for the photoresist mask layer over the head body region, an aspect ratio for the photolithographic process of less than 4:1 is achieved in the head pole tip region. However, the thickness of the photoresist mask layer in the head body/yoke region will be less than the desired thickness of the second pole piece, which creates a problem of a void beneath mushroomed overhanging edges. By back-filling the void with an insulating material at the time the head is sealed, the void problem is overcome.

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