Semiconductor-device package and semiconductor device

Details Semiconductor-device package and semiconductor device Semiconductor-device package and semiconductor device

1994-03-23

1995-04-04

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361736, 361749, 174 522, 174 524, 257687, 257693, 257706, 257713, 257796, H05K 720, H01L 2328

Patent

active

054042739

ABSTRACT:
A semiconductor-device package includes: a printed circuit board which has a chip-accommodating hole in its center portion and which has external connection terminals formed on its one side and a flexible substrate which has a supporting film having a central hole coaxial with the chip-accommodating hole, a given circuit pattern which is formed on the supporting film and inner leads which project inside the central hole and which have micro patterns, the flexible substrate being bonded on the other side of the circuit pattern of the printed circuit board with electrical conduction between them.

REFERENCES:
patent: 4964019 (1990-10-01), Belanger, Jr.
patent: 5251100 (1993-10-01), Fujita et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 4, "Tape Automated Bonding/Pin Grid Array Package," Sep. 1988, Armonk, N.Y., pp. 279-280.

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