Method for plating semiconductor chip headers

Details Method for plating semiconductor chip headers Method for plating semiconductor chip headers

1977-03-10

1978-09-12

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 508

Patent

active

041135776

ABSTRACT:
A method and apparatus for selectively plating the die-attach area of a semiconductor chip header are described. The apparatus comprises a rotary disc assembly. In the assembly there is provided a plurality of cavities for removably receiving individual headers. In each cavity there is provided an annular masking member for masking a header situated therein. Associated with each cavity, there is provided a cam-operated clamping means for clamping a header against the masking member and for coupling a source of potential to the header. Also associated with each cavity is a fluid jet for jetting a plating fluid against the header through a hole in the center of the sealing member. Plating fluid is selectively pumped, by means of a pumping means, to each of the jets along a plurality of fluid passageways from a fluid manifold. The fluid manifold is adapted to couple a predetermined number of the fluid passageways and jets to the pumping means as the disc assembly is rotated. Means are also provided for automatically releasing the clamping means and removing each header from the apparatus after completion of the plating operation.

REFERENCES:
patent: 2532907 (1950-12-01), Hangosky
patent: 2749300 (1956-06-01), Thomas
patent: 3897323 (1975-07-01), Schlotthauer
patent: 4007097 (1977-02-01), Noz

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