Method of making a thin-copper foil-carrier composite

Chemistry: electrical and wave energy – Processes and products

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427 32, C25D 104, C25D 120

Patent

active

041135768

ABSTRACT:
The present invention is directed to an improved method of making a thin copper foil preferably about 0.5 oz. per sq. ft. or less in weight, and carrier composite by forming, as by electroplating, the thin foil on a metallic surface such as a plating belt, then contacting the exposed side of the thin foil, while it is still on that metallic surface, with fusible solid plastic particles, depositing such particles on that exposed side of the foil and coalescing them together by sufficient heat to form them into a unitary plastic sheet, but insufficient to permit the plastic to migrate through any openings in the foil onto the metallic surface. The thus formed copper foil plastic carrier sheet composite is then readily removed from the metallic surface without any damage to the foil and without plastic build-up on the metallic plating surface. The method therefore can be operated efficiently continuously over long periods of time to produce a high quality composite product suitable for a variety of uses.

REFERENCES:
patent: 880484 (1908-02-01), Edison
patent: 2433441 (1947-12-01), Davidoff
patent: 3019126 (1962-01-01), Bartholomew
patent: 3248253 (1966-04-01), Barford et al.
patent: 3904346 (1975-09-01), Shaw
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 3990926 (1976-11-01), Konicek

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