Semiconductor device with an electrode pad having increased mech

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257786, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054040450

ABSTRACT:
A semiconductor device according to the present invention includes a lower conductive layer having a plurality of dummy conductive lines in addition to operative conductive lines. The operative and dummy conductive lines are connected to an electrode pad of upper conductive layer by through holes. The upper and lower conductive layers are insulated from each other by an interfacial insulation layer.

REFERENCES:
patent: 4970572 (1990-11-01), Kato et al.
patent: 5117280 (1992-05-01), Adachi

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