Method of forming solder bumps onto an integrated circuit device

Details Method of forming solder bumps onto an integrated circuit device Method of forming solder bumps onto an integrated circuit device

1996-04-30

1999-12-28

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including contaminant removal or mitigation

438616, 22818022, H01L 21283

Patent

active

06008071&

ABSTRACT:
Methods for forming solder bumps on terminal pads of a semiconductor substrate for an integrated circuit device employ a solder bump transfer plate and a mask to form solder deposits on the plate. One embodiment of the invention employs a metal mask having a plurality of through holes for forming solder deposits on the solder bump transfer plate by vapor phase deposition through the through holes each area of which increases in step wise from the first surface of the mask to the second surface opposite to the first surface, thereby preventing solder deposits in the through holes from being removed when the mask is separated from the plate. Another embodiment of the invention is a solder bump transfer plate having a plurality of solder deposits on the surface non-wettable to molten solder both diameter and spacing of which are both smaller than diameter and spacing of the terminal pads on the semiconductor substrate, whereby a single solder bump is accurately formed on each of the terminal pads.

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"Solder Ball Connectin Tensile-Pull Method", IBM TDB vol. 34 No. 11, pp. 152-153, Apr. 1992.

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