Adhesive of epoxy resins, epoxy-modified polybutadiene and photo

Details Adhesive of epoxy resins, epoxy-modified polybutadiene and photo Adhesive of epoxy resins, epoxy-modified polybutadiene and photo

1993-08-17

1995-04-04

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522170, 428246, 428901, 525524, C08G 5906, C08L 6302, C08L 6308

Patent

active

054038693

ABSTRACT:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

REFERENCES:
patent: 3646572 (1972-02-01), Burr
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 4097684 (1978-06-01), Burr
patent: 4173551 (1979-11-01), Crivello
patent: 4275190 (1981-06-01), Dudgeon
patent: 4401537 (1983-08-01), Chern et al.
patent: 4701513 (1987-10-01), Lin
patent: 4855333 (1989-08-01), Rudik et al.
patent: 5310840 (1994-05-01), Willett et al.
Derwent accession No. 87-69223/10 for Japanese Patent No. 62-23043, Jan. 31, 1987, Konishiroku Photo Ind. co., Ltd.
Derwent accession No. 86-202429/31 for Japanese Patent No. 61-136563, Jun. 24, 1984, Toyo Ink Mfg.

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