Method of forming an integrated circuit module

Details Method of forming an integrated circuit module Method of forming an integrated circuit module

1990-01-12

1991-11-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29833, 437 51, H01K 310

Patent

active

050672339

ABSTRACT:
A method of forming an integrated circuit module ae disclosed. The module includes a plurality of integrated circuit layers having beveled vertical edges along a portion thereof. The layers are connected to a contact board disposed orthogonal to the layers and also having a beveled first surface formed to receive and support the integrated circuit layers.

REFERENCES:
patent: 4620364 (1986-11-01), Landis
patent: 4822755 (1989-04-01), Hawkins et al.
patent: 4830985 (1989-05-01), Araghi et al.
patent: 4954458 (1990-09-01), Reid

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