Soldering apparatus

Details Soldering apparatus Soldering apparatus

1977-09-20

1978-09-12

Smith, Al Lawrence

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228 56, 118421, B23K 306

Patent

active

041131657

ABSTRACT:
The disclosure embraces a soldering apparatus which includes a vessel having an open top for containing a molten soldering material such as tin, a ladle having a scoop portion and a tank which is connected to the scoop by a pipe; the ladle is movable into and out of the vessel whereby the tank and scoop will become filled with the soldering material upon submergence of the ladle in the vessel; the tank has a selected dimension and lower height relative to the scoop so that the soldering material will form a meniscus bubble over its surface which will be free of slag or oxidation material to thereby present a clean soldering bath to the elements to be soldered when the tank is raised out of the soldering bath of the vessel.

REFERENCES:
patent: 2344589 (1944-03-01), Bogner
patent: 2857878 (1958-10-01), Matson et al.
patent: 3168885 (1965-02-01), Weiss
patent: 3980219 (1976-09-01), Schmid

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