Low thermal conductivity ceramic and process for producing the s

Details Low thermal conductivity ceramic and process for producing the s Low thermal conductivity ceramic and process for producing the s

1993-03-30

1995-04-04

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Refractory

501 97, C04B 35597

Patent

active

054037921

ABSTRACT:
The low thermal conductivity ceramic of the present invention comprises a sialon (Si--Al--O--N) and at least one element selected from among La, Dy, Ce, Hf and Zr and has an average grain size of 1.5 .mu.m or less and a thermal conductivity of 0.01 cal/cm.multidot.s.multidot..degree.C. or less. It can be produced by raising the temperature of a molding containing a sialon and the above elements in a gas atmosphere having a pressure of 5 arm or more at a high rate to conduct firing. The present invention enables the ceramic structure to be hyperfined and the phonon scattering to be enhanced, so that it is possible to provide a low thermal conductivity ceramic having a high strength and a low thermal conductivity.

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