Method and apparatus for endpointing mechanical and chemical-mec

Details Method and apparatus for endpointing mechanical and chemical-mec Method and apparatus for endpointing mechanical and chemical-mec

1997-08-21

1999-12-28

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 7, 451 53, B24B 100

Patent

active

060074086

ABSTRACT:
An apparatus and method for stopping mechanical and chemical-mechanical polishing of a substrate at a desired endpoint. In one embodiment, a polishing machine has a platen, a polishing pad positioned on the platen, and a polishing medium located at a planarizing surface of the polishing pad. The polishing machine also has a substrate carrier that may be positioned over the planarizing surface of the polishing pad, and at least one heat sensor is coupled to the polishing machine to detect heat at a front side of the substrate. The heat sensor preferably measures a temperature of a component sensitive to heat at the front side of the substrate, such as the planarizing surface of the polishing pad, the back side of the substrate, or the byproducts produced by polishing the substrate. In operation, the heat sensor monitors the heat at the front side of the substrate, and the removal of material from the substrate is stopped when the heat at the front side of the substrate changes from a first heat range to a second heat range.

REFERENCES:
patent: 4200395 (1980-04-01), Smith et al.
patent: 4203799 (1980-05-01), Sugawara et al.
patent: 4358338 (1982-11-01), Downey et al.
patent: 4367044 (1983-01-01), Booth, Jr. et al.
patent: 4377028 (1983-03-01), Imahashi
patent: 4422764 (1983-12-01), Eastman
patent: 4640002 (1987-02-01), Phillips et al.
patent: 4660980 (1987-04-01), Takabayashi et al.
patent: 4717255 (1988-01-01), Ulbers
patent: 4879258 (1989-11-01), Fisher
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5064683 (1991-11-01), Poon et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5220405 (1993-06-01), Barbee et al.
patent: 5314843 (1994-05-01), Yu et al.
patent: 5324381 (1994-06-01), Nishiguchi
patent: 5369488 (1994-11-01), Morokuma
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5461007 (1995-10-01), Kobayashi
patent: 5465154 (1995-11-01), Levy
patent: 5597442 (1997-01-01), Chen et al.
patent: 5609719 (1997-03-01), Hempel
patent: 5616069 (1997-04-01), Walker et al.
patent: 5643050 (1997-07-01), Chen
patent: 5663797 (1997-09-01), Sandhu
patent: 5733176 (1998-03-01), Robinson et al.
patent: 5762537 (1998-06-01), Sandhu et al.
patent: 5777739 (1998-07-01), Sandhu et al.
patent: 5855804 (1999-01-01), Walker

Affiliated with

Also associated with

Rating

Method and apparatus for endpointing mechanical and chemical-mec does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for endpointing mechanical and chemical-mec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for endpointing mechanical and chemical-mec will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2378609