Method for thinning of integrated circuit chips for lightweight

Details Method for thinning of integrated circuit chips for lightweight Method for thinning of integrated circuit chips for lightweight

1992-10-16

1994-06-28

Kunemund, Robert

Fishing, trapping, and vermin destroying

437207, 437209, 437974, H01L 21302, H01L 21463

Patent

active

053246870

ABSTRACT:
A method of thinning dice or integrated circuit chips used in producing lightweight packaged electronic systems, such as HDI circuits and systems produced therefrom provides for positioning dice in a die carrier layer that allows for easy separation from the dice after completion of the die thinning step. A holding layer is then attached to the die carrier layer for ease of attaching it to a material removal device, such as a lapping machine or an ultrasonic milling machine. A portion of the die carrier layer, along its exposed side, is then removed by the material removal device as a consequence of removal, by the material removal device, of an expendable portion of the dice positioned within the die carrier layer. The holding layer and the die carrier layer are then separated from the thinned dice by a conventional method, such as chemical etching, solvent soaking or induction heating. The thinned dice are significantly lighter than their original weight and their uniform thickness makes them well suited for mass produced lightweight electronic systems and flexible assemblies, such as HDI circuits.

REFERENCES:
patent: 3903590 (1975-09-01), Yokogawa
patent: 4450652 (1984-05-01), Walsh
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4842677 (1989-06-01), Wojnarowski et al.
patent: 4866501 (1989-09-01), Shanefield
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4907062 (1990-03-01), Fukushima
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 5016084 (1991-05-01), Nakao
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5051378 (1991-09-01), Yagi et al.
patent: 5155068 (1992-10-01), Tada

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