Method of manufacturing semiconductor device using hydrogen as a

Fishing – trapping – and vermin destroying

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437154, 437164, 437937, H01L 21225

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053246861

ABSTRACT:
A method of manufacturing a semiconductor device, which comprises the steps of forming a solid phase diffusion source containing a conductive impurity on a surface of a semiconductor substrate, said impurity serving to enable said semiconductor substrate to exhibit a p-type or n-type conductivity, allowing said solid phase diffusion source to contain a diffusion control substance serving to reduce or oxidize said conductive impurity upon heating so as to change the diffusion coefficient of the conductive impurity contained in the solid phase diffusion source, and thermally diffusing the conductive impurity from the solid phase diffusion source into the semiconductor substrate.

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patent: 4571366 (1986-02-01), Thomas et al.
patent: 4597824 (1986-07-01), Shinada et al.
patent: 5173440 (1992-10-01), Tsunashima et al.
Wolf et al., Silicon Processing for the VLSI Era, (1986) pp. 280-283.
Japanese Journal of Applied Physics, vol. 9, No. 6, pp. 691-704 "Structural Changes of Arsenic Silicate Glasses with Heat Treatments"; Arai et al.; Jun. 1970.
Journal of Applied Physics, vol. 56, No. 10, pp. 2708-2715, "Diffusion Ion Implanted as in SiOz"; A. H. Van Ommen; Nov. 1984.

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