Composite transversely plastic interconnect for microchip carrie

Details Composite transversely plastic interconnect for microchip carrie Composite transversely plastic interconnect for microchip carrie

1993-02-26

1994-06-28

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428402, 428403, B32B 900

Patent

active

053245695

ABSTRACT:
A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

REFERENCES:
patent: 4914814 (1990-04-01), Behun et al.
patent: 4927697 (1990-05-01), Ihill
patent: 5159535 (1992-10-01), Desai et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5201451 (1993-04-01), Desai et al.

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