Method of forming a multilayered structure

Details Method of forming a multilayered structure Method of forming a multilayered structure

1993-09-07

1994-06-28

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 4272552, 427253, C23C 1400, C23C 1600

Patent

active

053245369

ABSTRACT:
A method of forming a multilayered structure by flattening an uneven deposited surface thereof. It comprises the steps of: forming lower and higher portions on the deposited surface with different kinds of materials; and depositing a material selectively on the lower portions alone on the surface using the difference in nucleation density between the deposited materials due to the kinds of the materials of the deposited surface, thereby flattening the surface.

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