Semiconductor chip mounting method and apparatus

Details Semiconductor chip mounting method and apparatus Semiconductor chip mounting method and apparatus

1993-05-04

1994-06-28

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156360, 356388, 356390, 356395, 356398, 356399, 437 7, 437 8, 437209, H01L 2160

Patent

active

053243811

ABSTRACT:
The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).

REFERENCES:
patent: 3684384 (1972-08-01), Hojo et al.
patent: 4833621 (1989-05-01), Umatate
patent: 4902631 (1990-02-01), Downey et al.
patent: 5262355 (1993-11-01), Nishiguchi et al.

Affiliated with

Also associated with

Rating

Semiconductor chip mounting method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip mounting method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip mounting method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2375558