Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1994-05-26
1996-01-02
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257741, 257622, 257734, H01L 2348, H01L 2352, H01L 2940
Patent
active
054811384
ABSTRACT:
The present invention relates generally to a new structure and a method for repairing electrical lines, and more particularly, the invention encompasses a structure and a method for repairing electrical lines on a ceramic or a semiconductor substrate. On a substrate that has an open or an electrical discontinuity, one or more trenches or grooves are made next to the open, or discontinuity and using standard deposition process one or more metals are deposited in the open to provide or restore electrical continuity while the excess deposition material is allowed to drain or propagate into the trench.
REFERENCES:
patent: 4258078 (1981-03-01), Coller et al.
patent: 4259367 (1981-03-01), Dougherty, Jr.
patent: 4403410 (1983-09-01), Robinson
patent: 4418264 (1983-11-01), Thorwarth
patent: 4572941 (1986-03-01), Sciaky et al.
patent: 4615765 (1986-10-01), Levinson et al.
patent: 4630355 (1986-12-01), Johnson
patent: 4704304 (1987-11-01), Amendola et al.
patent: 4714684 (1987-12-01), Sugahara et al.
patent: 4756927 (1988-07-01), Black et al.
patent: 4877481 (1989-10-01), Fukuda et al.
patent: 4880959 (1989-11-01), Baum et al.
patent: 4882200 (1989-11-01), Liu et al.
patent: 4906491 (1990-03-01), Yamazaki
patent: 4908938 (1990-03-01), Thorwarth et al.
patent: 4919971 (1990-04-01), Chen
patent: 5064681 (1991-11-01), Berry et al.
patent: 5091218 (1992-02-01), Altman et al.
patent: 5130172 (1992-07-01), Hicks et al.
patent: 5145714 (1992-09-01), Reisman et al.
patent: 5153408 (1992-10-01), Handford et al.
patent: 5182230 (1993-01-01), Donelon et al.
patent: 5193732 (1993-03-01), Interrante et al.
patent: 5213983 (1993-05-01), Gustafsson et al.
patent: 5229845 (1993-07-01), Ueba et al.
IBM Technical Disclosure Bulletin (Gobran), vol. 27, No. 5, p. 3041 (Oct. 1984), entitled "Tailless Thermo-Compression Bonding".
IBM Technical Disclosure Bulletin (Anderson, et al.), vol. 26, No. 12, pp. 6244-6245 (May 1984), entitled "Josephson Package Repair".
IBM Technical Disclosure Bulletin (Bakos, et al.), vol. 22, No. 9, pp. 3986-3987 (Feb. 1980), entitled "Circuit Repair/Work of Metallized Polyimide Substrates".
IBM Technical Disclosure Bulletin (Mackey, et al.), vol. 15, No. 8, p. 2423 (Jan. 1973), entitled "Conductive Line Jumper/Repair Connection in Glass Metal Module".
IBM Technical Disclosure Bulletin (Tappen), vol. 14, No. 10, p. 2915 (Mar. 1972), entitled "Open Conductor Repair for Glass Metal Module".
IBM Technical Disclosure Bulletin (Mutnick), vol. 8, No. 11, p. 1469 (Apr. 1966), entitled "Repairing Breaks in Printed Circuits".
IBM Technical Disclosure Bulletin (Foulner), vol 9, No. 10, p. 1309 (Mar. 1967).
Economikos Laertis
Surprenant Richard P.
Ahsan Aziz M.
Guay John
International Business Machines - Corporation
Jackson, Jr. Jerome
LandOfFree
Structure and a method for repairing electrical lines does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Structure and a method for repairing electrical lines, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure and a method for repairing electrical lines will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-237431