Photoconductive member

Details Photoconductive member Photoconductive member

1984-05-07

1985-07-30

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Electric or magnetic imagery, e.g., xerography,...

Radiation-sensitive composition or product

2525011, 357 2, 427 74, 430 57, 430 60, 430 63, 430 65, 430 66, 430 67, G03G 508, G03G 5082, B05D 512, H01L 4500

Patent

active

045321981

ABSTRACT:
A photoconductive member is provided, which comprises a support for photoconductive member and a light receiving layer with a layer constitution, comprising a first layer region containing at least germanium atoms of which at least a portion is crystallized, a second region comprising an amorphous material containing at least silicon atoms and germanium atoms, a third layer region comprising an amorphous material containing at least silicon atoms and exhibiting photoconductivity, and a fourth layer region comprising an amorphous material containing silicon atoms and carbon atoms, provided successively in the order mentioned from the said support side.

REFERENCES:
patent: 3647427 (1972-03-01), Hanada et al.
patent: 4341851 (1982-07-01), Mooney et al.
patent: 4342044 (1982-07-01), Ovshinsky et al.
patent: 4343881 (1982-08-01), Sher et al.
patent: 4365013 (1982-12-01), Ishioka et al.
patent: 4402762 (1983-09-01), John et al.
patent: 4414319 (1983-11-01), Shirai et al.
patent: 4415760 (1983-11-01), Madan
patent: 4448801 (1984-05-01), Fukuda et al.
patent: 4460669 (1984-07-01), Ogawa et al.
patent: 4460670 (1984-07-01), Ogawa et al.
patent: 4471042 (1984-09-01), Komatsu et al.
patent: 4491626 (1985-01-01), Kawamura et al.

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