Thermosetting silicone resin molding composition

Details Thermosetting silicone resin molding composition Thermosetting silicone resin molding composition

1977-07-28

1979-03-13

Marquis, Melvyn I.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260825, 264331, 264329, 528 18, 528 31, 528 33, 528 36, 528 43, 260 18S, 260 28R, 260 291SB, C08L 8304

Patent

active

041442229

ABSTRACT:
An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.

REFERENCES:
patent: 2833732 (1968-05-01), Weyer
patent: 3127363 (1964-03-01), Nitzsche et al.
patent: 3208961 (1965-09-01), Kookootsedes
patent: 3560244 (1971-02-01), Neuroth
patent: 3627729 (1971-12-01), Trego
patent: 3839280 (1974-10-01), Zdaniewski
patent: 3867343 (1975-02-01), Garden

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