Plasma etching apparatus II-conical-shaped projection

Electric heating – Metal heating – By arc

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219121PE, 219121PF, 204192E, 156643, 156345, 250531, 250534, 250539, B23K 900

Patent

active

043072836

ABSTRACT:
An improved radial flow parallel plate plasma etcher, whose more uniform etching rate of wafers is due to radially decreasing the spacing between the electrodes wherein the gap between the electrodes is greatest at the circumference and smallest at center of the electrodes.

REFERENCES:
patent: 3572875 (1971-03-01), Noble
patent: 3664942 (1972-05-01), Havas et al.
patent: 3816196 (1974-06-01), La Combe
patent: 3859535 (1975-01-01), Bartz
patent: 3879597 (1975-04-01), Bersin et al.
patent: 4017404 (1977-04-01), Habeger
patent: 4033287 (1977-07-01), Alexander, Jr. et al.
patent: 4134817 (1979-01-01), Bourdon
patent: 4148705 (1979-04-01), Battey et al.
"Device Etching for Microscope Sample Preparation", IBM Disclosure, vol. 15, No. 2, Jul. 1972, 156-345 by Deines.
"Achieving Uniform Etch Rates in Reactive Ion Plasma Etching Processes", by Gartner et al., IBM Disclosure, vol. 20, No. 7, 12-1977.

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