Metal mold for sealing semiconductor devices with a resin

Details Metal mold for sealing semiconductor devices with a resin Metal mold for sealing semiconductor devices with a resin

1993-10-14

1994-10-18

Nguyen, Khanh

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

Molding of thermosetting or cross-linking stock

425556, 425436R, 425444, 425DIG51, 425DIG228, 26427217, 2643289, B29C 4502, B29C 4514, B29C 4538, B29C 4542

Patent

active

053562836

ABSTRACT:
A metal mold for sealing a semiconductor device with a resin and including a shutter gate mechanism. The mold drives a shutter gate pin by using the ejection stroke of a conventional seal press, and therefore eliminates the need for an extra drive source. It follows that the mold can be implemented only if an existing facility is slightly modified, and it is lower in cost than conventional metal molds.

REFERENCES:
patent: 4466934 (1984-08-01), Cane et al.
patent: 4723899 (1988-02-01), Osada
patent: 5074779 (1991-12-01), Tsutsumi et al.
patent: 5141430 (1992-08-01), Mans et al.

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