Semi-conductor assembly

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 75, 357 76, 357 81, H01L 2342

Patent

active

046426710

ABSTRACT:
A semi-conductor assembly is provided having first, second and third electrically conductive members, and a semi-conductor diode positioned between said first and second conductive members. The diode has its anode region electrically connected to said first conductive member and its cathode region electrically connected to the second conductive member. A semi-conductor thyristor positioned between said second and third conductive members, said semi-conductor thyristor is having its anode terminal region connected to the second conductive member and its cathode terminal region connected to the third conductive member. The third and first electrically conductive members are electrically interconnected, and at least one of said first, second and third electrically conductive members constitutes a heat sink for the assembly. The assembly further includes a connector for making an electrical connection to the gate terminal region of the thyristor.

REFERENCES:
patent: 3743893 (1973-07-01), Yamamoto
patent: 3844029 (1974-10-01), Dibugnara
patent: 3992717 (1976-11-01), Rice
patent: 4245232 (1981-01-01), Bacuvier
patent: 4305087 (1981-12-01), Wislocky
patent: 4313128 (1982-01-01), Schlegel et al.
patent: 4314271 (1982-02-01), Heyke et al.
patent: 4492975 (1985-01-01), Yamada et al.
patent: 4518983 (1985-05-01), Longenecker et al.
patent: 4538171 (1985-08-01), Stevens et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semi-conductor assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semi-conductor assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semi-conductor assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2365841

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.