Semiconductor device insulation method

Details Semiconductor device insulation method Semiconductor device insulation method

1977-06-20

1979-03-13

James, Andrew J.

Metal working

Method of mechanical manufacture

Assembling or joining

357 72, 357 80, 29589, 29627, 174 52PE, B01J 1700, H01L 110, H05K 328

Patent

active

041434560

ABSTRACT:
A method for applying a protective covering for a semi-conductor device which comprises a circuit board having formed thereon a conductive pattern on which a chip of the semi-conductor device is mounted and electrically connected to said conductive pattern, an insulating resin film having a low surface energy to provide a repellent property and formed on said circuit board around the chip of the semi-conductor device by a printing technique, and a resin molded seal formed on said circuit board to conseal said chip within a space defined by said insulating resin film, the flow of resin being blocked by the repellent property of said insulating resin film during a molding process.

REFERENCES:
patent: 3381071 (1968-04-01), Logan et al.
patent: 3622419 (1971-11-01), London
patent: 3778686 (1973-12-01), Galvin et al.
patent: 3938177 (1976-02-01), Hansen et al.

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