Metal layer patterning method

Details Metal layer patterning method Metal layer patterning method

1984-08-20

1987-02-10

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

20412975, 20412995, C25F 304

Patent

active

046421688

ABSTRACT:
A metal layer of aluminum, an aluminum-silicon alloy, aluminum-copper alloy to be patterned is formed on an insulating substrate and a mask layer of a predetermined pattern is formed on the metal layer and then the metal layer is subjected to electrolytic etching by an electrolyte through the mask layer, forming a patterned metal layer. When the metal layer is formed of aluminum, the electrolyte is an aqueous solution including a solute consisting principally of phosphoric acid; phosphoric acid and nitric acid; phosphoric acid, nitric acid and acetic acid; hydrochloric acid; potassium hydroxide; or sodium hydroxide. When the metal layer is formed of the aluminum-copper alloy, the electrolyte is an aqueous solution including a solute consisting principally of phosphoric acid; phosphoric acid and nitric acid; or phosphoric acid, nitric acid and acetic acid. A DC constant-current source is connected between the metal layer and electrode corresponding thereto, and the electrolytic etching is carried out until voltage between the metal layer and the electrode increases suddenly.

REFERENCES:
patent: 3108931 (1963-10-01), Wendell, Jr.
patent: 3260660 (1966-07-01), Brooks
patent: 3267013 (1966-08-01), Mathias et al.
patent: 3539408 (1970-10-01), Cashau et al.
patent: 3560357 (1971-02-01), Shaw
patent: 3576722 (1971-04-01), Fennimore et al.
patent: 3616349 (1971-10-01), Szupillo
patent: 3841931 (1974-10-01), MacArthur et al.
patent: 4135989 (1979-01-01), Pruett

Affiliated with

Also associated with

Rating

Metal layer patterning method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal layer patterning method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal layer patterning method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2362245