Process for packaging semiconductor device

Details Process for packaging semiconductor device Process for packaging semiconductor device

1994-12-20

1996-10-22

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437209, 437214, 437217, 437219, H01L 2160

Patent

active

055676561

ABSTRACT:
The process of the present invention is simplified by skipping the die bonding step, the wire bonding step and the trim-forming step of the conventional techniques. A semiconductor device may include: a plurality of bonding pads formed on the surface of the chip for connecting the internal circuit of the chip to an outer circuit; an insulating layer for insulating the surface of the chip, having a height higher than the height of the bonding pads, and formed on the whole surface of the chip except the portions where the bonding pads are formed; a plurality of bumps attached to the bonding pads; a plurality of pad type leads attached to the bumps; and a molding resin for covering the whole surface of the chip except the portions where the leads are disposed.

REFERENCES:
patent: 5066614 (1991-11-01), Dunaway et al.
patent: 5093281 (1992-03-01), Eshima
patent: 5095361 (1992-03-01), Iwata
patent: 5229328 (1993-07-01), Bregman
patent: 5358906 (1994-10-01), Lee

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