Electrochemical metal removal technique for planarization of sur

Details Electrochemical metal removal technique for planarization of sur Electrochemical metal removal technique for planarization of sur

1994-09-02

1996-10-22

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Gap maintenance or defined tool-workpiece gap

205654, 205668, 205670, 205672, 205674, 205686, 204224M, 204225, C25F 314, C25F 700

Patent

active

055673007

ABSTRACT:
A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.

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Contolini et al., "Electrochemical Planarization for Multi-Level Metallization", Proceeding of the the Second International Symposium of Electrochemical Technology Applications in Electronics, vol. No. 93-20.

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