Semiconductor device package having particular lead structure fo

Details Semiconductor device package having particular lead structure fo Semiconductor device package having particular lead structure fo

1991-09-09

1992-04-14

Hille, Rolf

357 70, H01L 2348

Patent

active

051052610

ABSTRACT:
The semiconductor device has leads projecting from at least two sides of all of a package which are bent in a zigzag manner so that ends of the leads lie on at least two planes. The semiconductor device may be mounted across a plurality of printed circuit boards by fixing a part of the leads from one side to a first board and fixing a remaining part of the leads from the other side to a second board, or by fixing a part of the leads on one plane to a first board and fixing a remaining part of the leads on the other plane to a second board.

REFERENCES:
patent: 5025307 (1991-06-01), Ueda et al.

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