Semiconductor device package structure

Details Semiconductor device package structure Semiconductor device package structure

1988-03-30

1990-05-08

Hille, Rolf

357 68, 357 80, H01L 2304, H01L 2312

Patent

active

049242970

ABSTRACT:
A semiconductor device package comprising a package wall through which the position of the semiconductor device is to be determined. The package wall has apertures for exposing edges of the semiconductor device, thereby allowing the position of the semiconductor device to be determined accurately.

REFERENCES:
Kohn, "A Charge-Coupled Infrared Imaging Array with Schottky-Barrier Detectors", Journal of Solid State Circuits, vol. SC-11, No. 1, Feb. 1976.
Kozonocky et al, "High-Performance Schottky-Barrier IR-CCD Image Sensors", Proceedings of the 14th Conference (1982 International) on Solid State Devices, Tokyom 1982.
Elabd et al, "High Density Schottky Barrier . . . at Intermediate Temperature", SPIE, vol. 35 . . . (1982).

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