Thermoplastic ballast housing in a novel three-dimensional print

Electric lamp and discharge devices: systems – Miscellaneous systems

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Details

361397, 361399, 361400, H05B 4100, H05K 103, H05K 502, H05K 714

Patent

active

049241524

ABSTRACT:
The present invention relates to an improved three-dimensional printed circuit board and a plastic housing for power conditioning electronics such as fluorescent lamp ballasts. The novel printed circuit board of the invention is a molded printed circuit board which is generally a rectangular parallelepiped having an upper relatively plain surface and a lower relatively plain surface but in addition having integral components thereon which extend for example above the upper relatively plain surface. Such integral components extending in this direction can be used for wire receptacles, module connectors and stand-offs. Suitable materials for the printed circuit board are thermoplastics such as polyarylate, polyethylene, terephthalate, polyimide, polyamide, polyester, polyphenylene sulfone, polyether sulfur, polyether imide and modified polyphenylene oxide. In a specific embodiment described in the application, the printed circuit board is a composite of two thermoplastics, a polyarylate and a polyethylene terephthalate. The invention also comprehends a metalless unpotted housing for an electronic power conditioning apparatus which includes plural thermoplastic housing components fitted together to form a closed integral housing where at least one of the thermoplastic housing components has an aperture for receiving a conductor receptacle, a three-dimensional molded printed circuit board supported within the housing and at least one integrally molded conductor receptacle of the printed circuit board extending from an interior of the housing to an exterior where the molded conductor receptacle includes a conductor receiving aperture, a fixed conductor extending from the conductor receiving aperture to a conductive trace on the printed circuit board.

REFERENCES:
patent: 4042819 (1977-08-01), Decal
patent: 4275331 (1981-06-01), Stresing
patent: 4338243 (1982-07-01), Hecht et al.
patent: 4352539 (1982-10-01), Vest
patent: 4352904 (1982-10-01), Deyrup
patent: 4379321 (1983-04-01), Plemmons et al.
patent: 4486564 (1984-12-01), Deyrup
patent: 4507719 (1985-03-01), Quiogue
patent: 4563729 (1986-01-01), Jendrewski
patent: 4752254 (1988-06-01), Inoue et al.
DuPont, "Rynite", Product Brochure No. E-62737.
Rogers, "DuPont Develops a New Line of Engineering Thermoplastics", American Metal Market, vol. 94, Nov. 10, 1986, p. 5(2).
Solenberger, "PET Resins Designed for Electronic/Electrical Needs", DuPont Brochure No. E-68719.
Wood, "Polyarylate: The New Buildup to `Workhorse` Status", Modern Plastics, Jul. 1987.

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